The PR material shows outstanding heat resistance, chemical resistance, mechanical property, and electrical property and this insulating material is applicable to FOWLP (Fan-Out PKG) technologies and new-concept 3 dimensional-integrated circuit in response to explosive growth of AI-based semiconductor market from 4th industrial revolution. It is developed based on PSPI (Photo-Sensitive Polyimide) with outstanding heat resistance, low dielectric constant, and coefficient of thermal expansion (CTE). This photoresist material is capable of low-temperature photolithography process in order to solve warpage issues which may occur in the highly integrated semiconductor package process.
Photo-definable Dielectric PR
